Job Description:

Northrop Grumman MS engineers share a great sense of pride knowing their contributions have a direct effect on the safety and security of the country and its allies. Our culture thrives on intellectual curiosity, cognitive diversity, teamwork, and bringing your whole self to work to accomplish the mission while learning and having fun along the way. The Airborne Multifunction Sensors Engineering and Sciences (AMS E&S) organization is fertile ground for all experience levels to become part of our growing team and contribute to our goals. The department offers opportunities to grow on a technical track both broad and deep as well as explore project leadership or management positions.Is this the next step in your career Find out if you are the right candidate by reading through the complete overview below.AMS E&S is seeking engineers with experience and interest in electronic assembly and packaging design including:Designing, modeling, and verifying RF, microwave, and mixed signal subsystem assembliesUtilize analysis, simulations, and prototyping to develop antenna designs including phased arraysDeriving and trading requirements with subsystem engineers and component level designersManaging RF budgets, frequency planning, and common assembly level interfacesPredicting assembly level performance through selecting materials, components, and packaging approaches, RF chain analysis, electromagnetic simulation, data collection and analysis, and other modeling techniquesWorking directly with component level design peers developing custom RF integrated circuit designs to meet assembly-level requirementsCollaborating with peer functions such as Mechanical, Manufacturing, Quality, Supply Chain, and TestUtilizing world class manufacturing capabilities both on-site and within the broader company for prototyping through full rate production from the foundry level to microelectronic packaging to printed circuit board fabrication and assembly to subsystem level integration and testWorking directly with a wide variety of different external supplier partners including leading domestic foundries, printed circuit board fabricators and assemblers, component manufacturers, material fabricators, and moreSupporting products throughout the product life cycleRF and mixed signal product types include antenna radiators, circulators, device interposers, filters, manifolds, receiver / exciter assemblies, signal conditioning assemblies, signal generators, and transmit / receive assembliesThis is an on-site position located in Linthicum, MD with easy access to the major cities of Baltimore to the north and Washington DC to the south. The location is a 2-hour drive to the Atlantic Ocean to the east or the Appalachian Mountains to the north and west. The area is rich with historical sites, museums, concerts and performing arts venues, one of the nation's top medical facilities, college and professional sports, nightlife, and many outdoor activities most notably boating and fishing on the Chesapeake Bay. The Linthicum campus includes the potential to live in urban, suburban, and waterfront communities within easy commutes and is conveniently located adjacent to the BWI International Airport and an Amtrak rail station.Principal Engineer Basic Qualifications:Electrical Engineering or related STEM field degree: Bachelor of Science with 5 years of RF/microwave experience; Master's degree with 3 years of RF/microwave experience; or PhD degreeAbility to provide solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty. Solutions are imaginative, thorough, and practical.Developing subject matter expertise in one or more areas of RF/Microwave discipline including but not limited to: RF components & assemblies, requirements development, EM and related modeling & simulation, RF test verification, production test support, and design for producibilityExhibit intermediate to expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (i.e. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA)US Citizenship is requiredProven knowledge of electrical engineering design software and equipmentEffective verbal and written communication skillsProductive in a team working environmentMust obtain interim secret (minimum) prior to startingAMC Advanced Program Award prior to candidate startingSenior Principal Engineer Basic Qualifications:Electrical Engineering or related STEM field degree: Bachelor of Science with 9 years of RF/microwave experience; Master's degree with 7 years of RF/microwave experience; PhD degree with 4 years of experienceAbility to develop solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty which require the regular use of ingenuity and creativityEstablished subject matter expertise in one or more areas of RF/Microwave discipline including but not limited to: RF components & assemblies, requirements development, EM and related modeling & simulation, RF test verification, production test support, and design for producibilityExhibit expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (i.e. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA)US Citizenship is requiredProven knowledge of electrical engineering design software and equipmentEffective verbal and written communication skillsAbility to design, implement, install and maintain electrical systemsTechnical Team LeadershipMust obtain interim secret (minimum) prior to startingAccess AMC Advanced Program Award prior to candidate startingPreferred Qualifications for both Principal and Senior Principal roles:Secret or Top Secret / SCI security clearanceRF and mixed signal printed circuit board and circuit card assembly level designRF budgeting, frequency planning, RF chain analysis and modeling, schematic capture, electromagnetic simulation, signal integrity analysisComponent selection and/or custom component requirements flow down and tradesCeramic and organic printed circuit board materials, design, fabrication, and assembly processesIntegrated Circuit packaging techniques including chip-and-wire, QFN, flip-chipRF lab equipment such as network analyzers, spectrum analyzers, signal generators, power meters, etc.Electronic troubleshooting from component to assembly levelsComplex data reduction and analysisProduct life cycle support from concept through production supportDesigning for high reliability, mil/aero requirements and environmentsAESA / phased array, Radar, SIGINT, or SATCOM experienceTechnical team leadershipExperience in the Aerospace or Defense IndustrySoftware tools: Mentor Xpedition DX Designer, ANSYS HFSS, Keysight ADS, Keysight Genesys, MathWorks MATLAB, Autodesk AutoCAD, and Microsoft Office Suite (Excel, PowerPoint, Project, Word)