Job Description:

Responsibilities:Design, simulate and validate advanced RF/mmWave packaging/module solutions. Liaise with OSAT vendors for manufacturing.Design, simulate and validate Integrated passive device (IPD). Liaise with foundry for Tapeout.Design PCB schematic, layout and perform circuit and 3D EM simulation.RF lab debug, tuning, performance optimization and validation. Is this the next step in your career Find out if you are the right candidate by reading through the complete overview below.Minimum Qualification:3+ years of experience in developing RF/mmWave packages and IPD design.At least BSEE or BSc in related engineering discipline In depth knowledge in electromagnetics, RF filters, PA and LNA design. Experience with foundry Tapeout and working with OSAT vendors.Experience in RF schematics, layouts, and DFM. Experience with RF lab equipment and probe station for device characterization, debug, and component/system performance validation.Experience using circuit, EM, and thermal simulation tools such as Ansys HFSS, Keysight ADS/Momentum, Cadence Allegro, Cadence Virtuoso, Ansys Icepak, Flotherm.Good communicator and team player.Preferred Qualification:MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design5+ years of relevant industry experienceFamiliar with RF system design. Familiar with regulatory requirements (FCC, CE, etc.).